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PRELIMINARY DATA SHEET
PHOTOCOUPLER
PS8551L4
HIGH CMR, ANALOG OUTPUT TYPE OPTICAL COUPLED ISOLATION AMPLIFIER
-NEPOC Series-
DESCRIPTION
The PS8551L4 is an optical coupled isolation amplifier that uses an IC provided with a high-accuracy A/D conversion function (sigma-delta modulation method) and a GaAIAs light-emitting diode with high-speed response and high luminance efficiency on the input side. On the output side IC provided with a high-accuracy D/A conversion function. The PS8551L4 is designed specifically for high common mode transient immunity (CMR) and high linearity (nonlinearity). The PS8551L4 is suitable for current sensing in motor drives.
FEATURES
* Non-linearity (NL200 = 0.35% MAX.) * High common mode transient immunity (CMR = 10 kV/s MIN.) * High isolation voltage (BV = 5 000 Vr.m.s.) * Gain tolerance (G = 3%) Gain: 8 V/V * Package: 8-pin DIP lead bending type (Gull-wing) for long creepage distance for surface mount (L4) * Ordering number of tape product : PS8551L4-E3 : 1 000 pcs/reel * Pb-Free product * Safety standards * UL approved: File No. E72422 * CSA approved: No. CA 101391 * BSI approved: No. 8937, 8938 * SEMKO approved: No. 611507 * NEMKO approved: No. P06207243 * DEMKO approved: No. 313935 * FIMKO approved: No. FI 22827 * DIN EN60747-5-2 (VDE0884 Part2) approved (Option)
1 8
PIN CONNECTION (Top View)
7 6 5
SHIELD
D/A Converter
A/D Converter
2
3
4
1. VDD1 2. VIN+ 3. VIN- 4. GND1 5. GND2 6. VOUT- 7. VOUT+ 8. VDD2
APPLICATIONS
* AC Servo, inverter * Measurement equipment
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Document No. PN10670EJ01V0DS (1st edition) Date Published September 2007 NS
2007
PS8551L4
PACKAGE DIMENSIONS (UNIT: mm) Lead Bending Type (Gull-wing) For Long Creepage Distance For Surface Mount (L4)
9.25-0.25
+0.5
10.050.4
1.01
+0.4 -0.2
6.5-0.1
+0.5
0.20.15
0.50.15
2.54
0.620.25
2
Preliminary Data Sheet PN10670EJ01V0DS
3.70.35
3.50.2
PS8551L4
MARKING EXAMPLE
No. 1 pin Mark
8551 NL731
Type Number Assembly Lot
N L 7 31
Week Assembled Year Assembled (Last 1 Digit)
In-house Code (L: Pb-Free)
Rank Code
Preliminary Data Sheet PN10670EJ01V0DS
3
PS8551L4
ABSOLUTE MAXIMUM RATINGS (TA = 25C, unless otherwise specified)
Parameter Operating Ambient Temperature Storage Temperature Supply Voltage Input Voltage 2 Seconds Transient Input Voltage Output Voltage Symbol TA Tstg VDD1, VDD2 VIN+, VIN- VIN+, VIN- VOUT+, VOUT- MIN. -40 -55 0 -2 -6 -0.5 MAX. 100 125 5.5 VDD1+0.5 VDD1+0.5 VDD2+0.5 Unit C C V V V V
RECOMMENDED OPERATING CONDITIONS (TA = 25C, unless otherwise specified)
Parameter Operating Ambient Temperature Supply Voltage Input Voltage (Accurate and Linear) Symbol TA VDD1, VDD2 VIN+, VIN- MIN. -40 4.5 -200 MAX. 85 5.5 200 Unit C V mV
4
Preliminary Data Sheet PN10670EJ01V0DS
PS8551L4
ELECTRICAL CHARACTERISTICS (DC Characteristics) (TYP.: TA = 25C, VIN+ = VIN- = 0 V, VDD1 = VDD2 = 5 V, MIN., MAX.: TA = -40 to +85C, VIN+ = VIN- = -200 to 200 mV, VDD1 = VDD2 = 4.5 to 5.5 V, unless otherwise specified)
Parameter Input Offset Voltage Symbol Vos TA = 25C Conditions MIN. -2 -3 Input Offset Voltage Drift vs. Temperature Gain VOUT Gain Drift vs. Temperature VOUT Non-linearity (200 mV)
*1
TYP. 0.3
MAX. 2 3
Unit mV
dVos/dTA
TA = -40 to +85C
3
10
V/C
V/V V/VC
G dG/dTA NL200
-200 mV VIN+ 200 mV TA = -40 to +85C -200 mV VIN+ 200 mV
7.76
8 0.00084 0.038 0.0002
8.24
0.35
% %/C
VOUT Non-linearity (200 mV) Drift vs. Temperature VOUT Non-linearity (100 mV)
*1
dNL200/dTA TA = -40 to +85C
NL100 VIN+MAX.
-100 mV VIN+ 100 mV
0.026 308
0.2
% mV
Maximum Input Voltage before VOUT Clipping Input Supply Current Output Supply Current Input Bias Current Input Bias Current Drift vs. Temperature Low Level Saturated Output Voltage High Level Saturated Output Voltage Output Voltage (VIN+ = VIN- = 0 V) Output Short-circuit Current Equivalent Input Resistance VOUT Output Resistance Input DC Common-Mode Rejection Ratio
*2
IDD1 IDD2 IIN+ dIIN+/dTA
VIN+ = 400 mV VIN+ = -400 mV VIN+ = 0V TA = -40 to +85C
14.5 10 -0.5 0.45
18 16 5
mA mA
A
nA/C
VOL VOH VOCM IOSC RIN ROUT CMRRIN
VIN+ = -400 mV VIN+ = 400 mV VIN+ = VIN- = 0 V 2.2
1.29 3.8 2.55 18.6 300 15 46 2.8
V V V mA k dB
*1 Non-linearity : [Half of peak-to-peak output voltage deviation from best fit gain line] / [Full-scale differential output voltage] (%). *2 CMRRIN is defined as the ratio of the differential signal gain (apply the differential signal between VIN+ and VIN-) to the isolation-mode gain (connect both input pins to GND1 and apply the signal between PS8551L4's input and output) at 60 Hz. This value is indicated in dB.
Preliminary Data Sheet PN10670EJ01V0DS
5
PS8551L4
ELECTRICAL CHARACTERISTICS (AC Characteristics) (TYP.: TA = 25C, VIN+ = VIN- = 0 V, VDD1 = VDD2 = 5 V, MIN., MAX.: TA = -40 to +85C, VIN+ = VIN- = -200 to 200 mV, VDD1 = VDD2 = 4.5 to 5.5 V, unless otherwise specified)
Parameter VOUT Bandwidth (-3 dB) VOUT Noise VIN to VOUT Signal Delay (50 to 10%) VIN to VOUT Signal Delay (50 to 50%) VIN to VOUT Signal Delay (50 to 90%) VOUT Rise Time/Fall Time (10 to 90%) Common Mode Transient Immunity Power Supply Noise Rejection
*2 *1
Symbol fC NOUT tPD10 tPD50 tPD90 tr/tf CMR PSR
Conditions VIN+ = 200 mVp-p, sine wave VIN+ = 0 V VIN+ = 0 to 150 mV step
MIN. 50
TYP. 100 31.5 2.03 3.47 4.99
MAX.
Unit kHz mVr.m.s.
3.3 5.6 9.9 6.6
s
VIN+ = 0 to 150 mV step VCM = 1 kV, TA = 25C f = 1 MHz 10
2.96 15 170
s
kV/s mVr.m.s.
*1 CMR is tested by applying steep rise/fall time (50 ns) voltage step between PS8551L4's input and output. The voltage step is amplified until the differential output voltage (VOUT+ - VOUT-) reaches more than 200 mV (> 1 s) deviation from the average output voltage. *2 This is the value of the transient voltage at the differential output when 1 Vp-p, 1 MHz, and 40 ns rise/fall time square wave is applied to both VDD1 and VDD2.
PACKAGE CHARACTERISTICS
Parameter Isolation Voltage Isolation Resistance Isolation Capacitance Symbol BV RI-O CI-O Conditions RH = 60%, t = 1 min., TA = 25C VI-O = 500 VDC f = 1 MHz MIN. 5 000 > 10 1.2
9
TYP.
MAX.
Unit Vr.m.s. pF
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static electricity when handling. 2. Board designing (1) By-pass capacitor of more than 0.1 F is used between VDD and GND near device. Also, ensure that the distance between the leads of the photocoupler and capacitor is no more than 10 mm. (2) Make sure the distance between input terminal (VIN+ and VIN-) of PS8551L4 and the devices (or components) to be connected is as close as possible. (3) Make sure the distance between output terminal (VOUT+ and VOUT-) of PS8551L4 and the devices (or components) to be connected is as close as possible. 3. Avoid storage at a high temperature and high humidity.
6
Preliminary Data Sheet PN10670EJ01V0DS
PS8551L4
TAPING SPECIFICATIONS (UNIT: mm)
Outline and Dimensions (Tape)
2.00.1 4.00.1 1.5 +0.1 -0 1.750.1
4.65 MAX.
16.00.3
7.50.1
10.550.1
1.550.1 12.00.1
9.950.1
4.20.1 0.30.05
Tape Direction
PS8551L4-E3
Outline and Dimensions (Reel)
2.00.5
2.00.5 13.00.2 3302.0 21.00.8 1001.0
R 1.0
17.51.0 21.51.0
Packing: 1 000 pcs/reel
15.9 to 19.4 Outer edge of flange
Preliminary Data Sheet PN10670EJ01V0DS
7
PS8551L4
NOTES ON HANDLING 1. Recommended soldering conditions
(1) Infrared reflow soldering * Peak reflow temperature * Time of peak reflow temperature * Time of temperature higher than 220C * Time to preheat temperature from 120 to 180C * Number of reflows * Flux 260C or below (package surface temperature) 10 seconds or less 60 seconds or less 12030 s Three Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.)
Recommended Temperature Profile of Infrared Reflow
Package Surface Temperature T (C)
(heating) to 10 s 260C MAX. 220C to 60 s 180C 120C 12030 s (preheating)
Time (s)
(2) Wave soldering * Temperature * Time * Preheating conditions * Number of times * Flux 260C or below (molten solder temperature) 10 seconds or less 120C or below (package surface temperature) One (Allowed to be dipped in solder including plastic mold portion.) Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by soldering iron * Peak temperature (lead part temperature) * Time (each pins) * Flux 350C or below 3 seconds or less Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead. (b) Please be sure that the temperature of the package would not be heated over 100C.
8
Preliminary Data Sheet PN10670EJ01V0DS
PS8551L4
(4) Cautions * Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that a malfunction may occur if voltage is applied suddenly between the photocoupler's input and output, even if the voltage is within the absolute maximum ratings.
Preliminary Data Sheet PN10670EJ01V0DS
9
PS8551L4
* The information in this document is current as of September, 2007. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. * NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. * NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above).
M8E 02. 11-1
10
Preliminary Data Sheet PN10670EJ01V0DS
PS8551L4
Caution
GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. * Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. * Do not burn, destroy, cut, crush, or chemically dissolve the product. * Do not lick the product or in any way allow it to enter the mouth.

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